2019 Technology 2-Day Workshop
Print Process Characterization through the use of SPI
Two Day Workshop: October 23, 24 2019
API Demolab at Westford Regency
219 Littleton Road
Westford, MA 01886
Ray Welch, Koh Young America
Ray Welch is a Sr. Applications Engineer at Koh Young America, focused on helping customers enhance the effectiveness of their use of Solder Paste Inspection (SPI), and its application for characterizing and optimizing their paste printing process. He will be presenting material to help the workshop participants advance their understanding of SPI. Moving beyond its use as a “Go-No Go” inspection system through tools and techniques for detailed SPI data analysis, and how Print Process Characterization can be used to more fully optimize the process.
Doug Africano, Panasonic
Doug Africano is a Solutions Engineer in the Process Automation division of Panasonic Systems Solution Company of North America, Doug supervises Panasonic’s Cloud9 Technology Center in Buffalo Grove, Illinois which showcases Panasonics’ solution offerings . He will share Panasonic’s Adaptive Process Control (APC) technology which is fully integrated with Koh Young’s SPI and AOI systems.